Benefits and Reliability of a Thin Dielectric in a Power Supply Printed
Circuit Board - Valerie St. Cyr Teradyne
Miniaturization Technologies for Handheld Communication devices - John
Savic Motorola Labs
Reduction of Discrete Capacitors Using Embedded Capacitance Layers:
Simulation versus Actual Results - Kaz Yamazaki, John Andresakis &
Yoshi Fukawa
Growth and Characterizations of Bismuth Zinc Niobate Thin Films for
Embedded Capacitors - Jung Won Lee, In Hyung Lee, Yul Kyo Chung and
Yong Soo Oh
Embedded Passives, Uniformity and Environmental Stability - Tom Clifford
and Melissa Lau
Embedding of Active and Passive Components into flexible PCB's -
Thomas Loher
Decoupling of High Performance Semiconductors Using Embedded
Capacitor Technology - Bill Borland
Sun's Experience with 1-mil Laminates for Power Distribution
Applications - Istvan Novak
Novel Substrate with Combined Embedded Capacitance and Resistance
for Better Electrical Performance and Higher Integration - John
Andresakis, Pranabes Pramanik, Dan Brandler & Dong Nong
Transport Technologies for Thin and Flexible Materials - Don Ball and Mike
Soble
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