Inductor, Coil, Tranformer, Chip Bead and LAN
Magnetics
MoxiE Inductors Product Guide
MoxiE LAN Magnetics Update
MoxiE RF45 Magnetics Update
White papers from the IPC 3rd International
Conference on Embedded Technology
IPC Embedded Technology Papers
How to specify a microwave filter
How to specify a microwave filter (bandpass, lowpass & highpass)
Flex Circuit Materials
DuPont Pyralux AP Material (PDF)
DuPont Pyralux LF Sheet Adhesive
DuPont Pyralux FR Coverlay
DuPont Pyralux FR Copper Clad Laminates
DuPont Pyralux FR Bond Ply
DuPont Flexible Circuits Material Website
RF Materials
Arlon Microwave Materials 25N/25FR
Arlon 85NT, 55 NT & 55RT
Arlon Electronic Substrates Product Listing and Properties
Microwave Materials Product Listing and Properties
White Papers
Impact of reflowing of PB free solder alloy using a tin lead solder alloy
reflow profile on solder joint integrity
Effects of Sn / Ag / Cu alloy assembly reflow
Applying high-frequency materials in wireless & other RF applications:
materials and bonding agents
High-frequency construction techniques for RF applications and methods
to reduce complexity, size and improve performance
Board level packaging moves to higher levels
Impact of Unknown Component Alloy Finish During the Lead-free
Transition Period
Measuring and Modelling the Materials Properties Impact on Solder Joint
Reliability
Industry Resources
IPC Lead Free Site
IPC Halogen Free Site
IPC Standards and Manuals online (Free)
DOD Specifications and Standardization Site
Trace Current Calculator
Trace Width Calculator
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